JPH0470761B2 - - Google Patents

Info

Publication number
JPH0470761B2
JPH0470761B2 JP58217177A JP21717783A JPH0470761B2 JP H0470761 B2 JPH0470761 B2 JP H0470761B2 JP 58217177 A JP58217177 A JP 58217177A JP 21717783 A JP21717783 A JP 21717783A JP H0470761 B2 JPH0470761 B2 JP H0470761B2
Authority
JP
Japan
Prior art keywords
holding plate
chip component
chip
electrode
storage hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58217177A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60109204A (ja
Inventor
Koichi Nitsuta
Kazuma Kabuta
Katsumi Yamaguchi
Tadahiro Nakagawa
Katsuyuki Moryasu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP58217177A priority Critical patent/JPS60109204A/ja
Priority to US06/671,585 priority patent/US4664943A/en
Priority to GB08428919A priority patent/GB2151159B/en
Priority to DE19843441984 priority patent/DE3441984A1/de
Priority to FR8417640A priority patent/FR2555361B1/fr
Publication of JPS60109204A publication Critical patent/JPS60109204A/ja
Priority to US07/016,714 priority patent/US4788931A/en
Publication of JPH0470761B2 publication Critical patent/JPH0470761B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H01G13/006—Apparatus or processes for applying terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP58217177A 1983-11-17 1983-11-17 チップ部品の外部電極形成方法 Granted JPS60109204A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP58217177A JPS60109204A (ja) 1983-11-17 1983-11-17 チップ部品の外部電極形成方法
US06/671,585 US4664943A (en) 1983-11-17 1984-11-15 Method of forming external electrodes of chip parts and tool for practicing same
GB08428919A GB2151159B (en) 1983-11-17 1984-11-15 Method of forming external electrodes of chip parts and tool therefor
DE19843441984 DE3441984A1 (de) 1983-11-17 1984-11-16 Verfahren zur herstellung von aussenelektroden an chipteilen und werkzeug zur durchfuehrung des verfahrens
FR8417640A FR2555361B1 (fr) 1983-11-17 1984-11-19 Methode de formation d'electrodes externes de composants en microplaquette et dispositif outil correspondant
US07/016,714 US4788931A (en) 1983-11-17 1987-02-19 Tool for forming external electrodes of chip parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58217177A JPS60109204A (ja) 1983-11-17 1983-11-17 チップ部品の外部電極形成方法

Publications (2)

Publication Number Publication Date
JPS60109204A JPS60109204A (ja) 1985-06-14
JPH0470761B2 true JPH0470761B2 (en]) 1992-11-11

Family

ID=16700066

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58217177A Granted JPS60109204A (ja) 1983-11-17 1983-11-17 チップ部品の外部電極形成方法

Country Status (5)

Country Link
US (2) US4664943A (en])
JP (1) JPS60109204A (en])
DE (1) DE3441984A1 (en])
FR (1) FR2555361B1 (en])
GB (1) GB2151159B (en])

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4561954A (en) * 1985-01-22 1985-12-31 Avx Corporation Method of applying terminations to ceramic bodies
JPS6229009A (ja) * 1985-07-29 1987-02-07 株式会社村田製作所 高周波用誘電体磁器組成物
JPS63195703U (en]) * 1987-06-04 1988-12-16
US4859498A (en) * 1987-11-18 1989-08-22 Murata Manufacturing Co., Ltd. Chip component holding plate
JPH0680602B2 (ja) * 1987-11-28 1994-10-12 株式会社村田製作所 電子部品チップ保持治具および電子部品チップ取扱い方法
JPH0680605B2 (ja) * 1987-11-28 1994-10-12 株式会社村田製作所 電子部品チップ保持治具および電子部品チップのメタライズ面への金属コーティング方法
US4903393A (en) * 1988-02-05 1990-02-27 Murata Manufacturing Co., Ltd. Method for inserting chip parts into a holding plate
US4847991A (en) * 1988-02-05 1989-07-18 Murata Manufacturing Co., Ltd. Method for inserting chip parts into a holding plate and apparatus used for the same
US5226382A (en) * 1991-05-20 1993-07-13 Denver Braden Apparatus for automatically metalizing the terminal ends of monolithic capacitor chips
JP3018645B2 (ja) * 1991-10-03 2000-03-13 株式会社村田製作所 チップ部品の製造方法
US5249906A (en) * 1991-11-08 1993-10-05 Murata Manufacturing Co., Ltd. Press machine for chip type electronic components
US5275661A (en) * 1991-11-08 1994-01-04 Murata Mfg. Co., Ltd. Dipping apparatus
JP2712960B2 (ja) * 1991-11-08 1998-02-16 株式会社村田製作所 ディップ装置
JP2760189B2 (ja) * 1991-11-08 1998-05-28 株式会社村田製作所 チップ部品の電極形成装置
KR960003139B1 (ko) * 1991-12-03 1996-03-05 가부시끼가이샤 무라따 세이사꾸쇼 칩 부품 프레스 방법
EP0572151A3 (en) * 1992-05-28 1995-01-18 Avx Corp Varistors with cathodically vaporized connections and method for depositing cathodically vaporized connections on varistors.
US5565838A (en) * 1992-05-28 1996-10-15 Avx Corporation Varistors with sputtered terminations
US5337893A (en) * 1992-07-22 1994-08-16 Electro Scientific Industries, Inc. High capacity carrier plate
GB2270527A (en) * 1992-09-11 1994-03-16 Rolls Royce Plc Coating a face of a component using apertured mask of same size as the face; turbine tip blades
JP3459840B2 (ja) * 1992-09-18 2003-10-27 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド ワークピース挿入装置
JP3049981B2 (ja) * 1992-12-04 2000-06-05 株式会社村田製作所 チップ部品の電極形成システム
JPH06304875A (ja) * 1993-04-20 1994-11-01 Murata Mfg Co Ltd 電子部品用保持具及び電子部品の取り扱い方法
JPH0684288U (ja) * 1993-05-14 1994-12-02 正己 鈴木 粉粒体の熱風循環式乾燥装置
GB2285759B (en) * 1994-01-05 1998-01-07 Murata Manufacturing Co Apparatus for pushing chip components into holding plate
JP3082575B2 (ja) * 1994-07-05 2000-08-28 株式会社村田製作所 セラミック電子部品の製造方法
US5916395A (en) * 1994-07-05 1999-06-29 Murata Manufacturing Co., Ltd. Method for fabricating ceramic electronic parts
JPH0883739A (ja) * 1994-09-13 1996-03-26 Rohm Co Ltd 側面電極付き電子部品の製造方法並びに製造用の治具
DE29513315U1 (de) * 1995-08-18 1995-10-19 Siemens Matsushita Components GmbH & Co. KG, 81541 München Vorrichtung zur Halterung von Bauelementen bei der Elektrodenaufbringung
US5894033A (en) * 1997-10-17 1999-04-13 Electro Scientific Industries Method of profiling the termination paste for chip capacitor electrodes
JP3772954B2 (ja) * 1999-10-15 2006-05-10 株式会社村田製作所 チップ状部品の取扱方法
JP3641217B2 (ja) * 2000-03-31 2005-04-20 Ｔｄｋ株式会社 チップ状電子部品における端部電極形成方法及び装置
JP4220460B2 (ja) * 2004-11-30 2009-02-04 Ｔｄｋ株式会社 外部電極形成方法
DE502007005242D1 (de) * 2006-02-24 2010-11-18 Roche Diagnostics Gmbh Platte für Verteilen von Kugeln
DE102020106985B4 (de) 2020-03-13 2023-04-27 Tdk Electronics Ag Verfahren zum Aufbringen einer Metallisierung auf mehrere elektronische Bauteile

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3358362A (en) * 1965-01-21 1967-12-19 Int Resistance Co Method of making an electrical resistor
US3578189A (en) * 1968-12-26 1971-05-11 John L Yonkers Method for orienting and assembling small parts
US4395184A (en) * 1980-02-21 1983-07-26 Palomar Systems & Machines, Inc. Means and method for processing miniature electronic components such as capacitors or resistors
US4393808A (en) * 1980-10-09 1983-07-19 Palomar Systems & Machines, Inc. Means for processing miniature electronic components
CA1192641A (en) * 1981-10-22 1985-08-27 Denver Braden Method of processing miniature electronic components such as capacitors or resistors
EP0078083B1 (en) * 1981-10-22 1987-03-18 Palomar Systems And Machines, Inc. Process and plate for processing miniature electronic components

Also Published As

Publication number Publication date
US4788931A (en) 1988-12-06
JPS60109204A (ja) 1985-06-14
DE3441984A1 (de) 1985-05-30
GB2151159B (en) 1987-09-30
FR2555361A1 (fr) 1985-05-24
FR2555361B1 (fr) 1988-11-10
GB2151159A (en) 1985-07-17
DE3441984C2 (en]) 1990-06-28
US4664943A (en) 1987-05-12

Similar Documents

Publication Publication Date Title
JPH0470761B2 (en])
JP2682250B2 (ja) 電子部品チップ用ホルダおよび電子部品チップの取扱方法
JPS5866652U (ja) 半導体素子用取付け構造
CA2027067A1 (en) Method for forming a continuous oxide superconductor layer having different thickness portions for superconductor device
JPH06188161A (ja) チップ部品コーティング治具及びそれを使用したコーティング方法
JPH044739B2 (en])
JPS63122202A (ja) 電子部品の端面電極塗布用治具および電子部品の端面電極塗布方法
JPH0344404B2 (en])
JPS5835964U (ja) 塗布装置
JPH0214510A (ja) チップ部品の保持プレート
JPH0810181Y2 (ja) 端部コーティング用電子パーツ保持具
JPS6135747U (ja) ウエハ−保持用ピンセツト
JPH0542122B2 (en])
JPH01264223A (ja) レジスト塗布装置
JPS5834932U (ja) フセメジテ−プ
JPS6218041Y2 (en])
JPS6320816A (ja) 電子部品の製造方法
JPS59142063U (ja) ウエブ塗工面の処理装置
JPH0388347A (ja) 樹脂転写体
JPS5845188B2 (ja) 多数の電気部品にグリ−スを一度に塗布する方法
JPH0922804A (ja) チップ部品供給装置
JPS58146570U (ja) 接着剤塗布装置
JPH03250726A (ja) 小形電子パーツ端部コーティング方法
JPS5952884U (ja) 玉子等の粘性物塗布装置
JPS58120197A (ja) 放射線遮蔽板